Method for manufacturing a fine-patterned thick film conductor structure
US4401521A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1981 |
| Grant date | Aug 30, 1983 |
| Priority date | — |
| Expiry date | Nov 20, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0726
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a fine-patterned thick film conductor structure free from ununiformity in film thickness comprises steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate using the thin metal plate as a cathode electrode to form conductors having a circuit density of no less than three lines/mm and a thickness of 15-200 .mu.m, bonding the electroplated thin metal plate to an insulative substrate with the thin metal plate side facing up and etching the thin metal plate. The fine-patterned conductors are suited for use in small-sized coils, high density connectors and high density wirings. Further disclosed is a method for manufacturing a fine-patterned thick film printed circuit board free from side protrusion comprising steps of forming resist on a thin metal plate at areas other than land areas, electroplating the thin metal plate to a thickness of 0.3-10 .mu.m at a current density of 0.05-2 A/dm.sup.2, electroplating the thin metal plate to a desired final thickness at a current density of 3-20 A/dm.sup.2, and removing all or the areas other than the land areas of the thin metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.