Process of heat treating copper film on ceramic body and heat treating apparatus therefor
US4402494A · kind A · utility
2Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1980 |
| Grant date | Sep 6, 1983 |
| Priority date | — |
| Expiry date | Oct 8, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for metallizing a copper film comprising the step of heat treating a copper film formed by an electroless plating process as opposing electrodes of a ceramic capacitor. The process comprises the steps of placing a ceramic body having a copper film formed on the surface thereof by an electroless plating process within a container sealing the same from the external atmosphere and maintaining constant the internal atmosphere, and heating the container maintaining the surrounding of the container in an inert atmosphere.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.