Method for providing an adherent electroless metal coating on an epoxy surface
US4402998A · kind A · utility
21Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1982 |
| Grant date | Sep 6, 1983 |
| Priority date | — |
| Expiry date | Sep 24, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of electrolessly plating a substrate having a rubber-modified epoxy surface includes the steps of preheating the substrate and while still warm, sputter etching at least 50A. from its surface. The substrate is then vacuum metalized with an adhesion promoting metal film, coated with a catalytic layer and a metal is electrolessly deposited thereover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.