Heat sink mounting
US4403102A · kind A · utility
39Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1981 |
| Grant date | Sep 6, 1983 |
| Priority date | — |
| Expiry date | Oct 23, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.