Manufacture of printed circuit boards
US4403410A · kind A · utility
17Cited by
5References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 14, 1981 |
| Grant date | Sep 13, 1983 |
| Priority date | — |
| Expiry date | Jan 14, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the manufacture of a printed circuit board is disclosed in which, during the process, conductive tracks 6 are tested for defects 8 relating to their conductivity and any detected defect 8 is repaired by securing a conductive bridge-piece 9 across the defect 8 by a reflow soldering operation. The repair is encapsulated with a protective layer 16 and the manufacturing process, which includes the further application of heat to the circuit board, is continued.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.