Compositions for the manufacture of hot-melt adhesives
US4404299A · kind A · utility
35Cited by
7References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 15, 1982 |
| Grant date | Sep 13, 1983 |
| Priority date | — |
| Expiry date | Apr 15, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/935
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition for the manufacture of hot-melt adhesives, in which the improvement comprises a terpolymer of ethylene having a melt index between 5 and 500 dg/minute and comprising from 1 to 10 mol % of units derived from an ester selected from alkyl acrylates and methacrylates, the alkyl group having from 1 to 6 carbon atoms, and from 0.3 to 3 mol % of units derived from maleic anhydride. The composition also contains at least one tackifying resin and may contain at least one compound selected from paraffin, microcrystalline polymeric wax, and esters of a hydrogenated rosinic acid and of a lower alcohol.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.