Heat curable epoxy resin compositions
US4404355A · kind A · utility
9Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1981 |
| Grant date | Sep 13, 1983 |
| Priority date | — |
| Expiry date | Sep 28, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/68
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to heat curable epoxy resin compositions consisting of an epoxy resin containing, on average, more than one epoxide group per molecule, an aromatic onium salt as catalyst, a copper complex compound as co-catalyst, and a light stabilizer. These compositions are less sensitive to UV irradiation and have a good shelf life at room temperature as well as a good high temperature reactivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.