Plating head
US4405432A · kind A · utility
38Cited by
2References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1982 |
| Grant date | Sep 20, 1983 |
| Priority date | — |
| Expiry date | Oct 22, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating head for spot plating a web of moving material that plates faster due to a large planar electrode that faces the plating area and a system of electrolyte channels that inject electrolyte at a high rate from the side of the electrode into the space between the electrode and the plating area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.