Hybrid method of making an amorphous silicon P-I-N semiconductor device
US4407710A · kind A · utility
7Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1981 |
| Grant date | Oct 4, 1983 |
| Priority date | — |
| Expiry date | Oct 15, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
The invention is directed to a hydrogenated amorphous silicon PIN semiconductor device of hybrid glow discharge/reactive sputtering fabrication. The hybrid fabrication method is of advantage in providing an ability to control the optical band gap of the P and N layers, resulting in increased photogeneration of charge carriers and device output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.