Patent · US Expired

Hybrid method of making an amorphous silicon P-I-N semiconductor device

US4407710A · kind A · utility

7Cited by
3References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 15, 1981
Grant dateOct 4, 1983
Priority date
Expiry dateOct 15, 2001

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50

Abstract

The invention is directed to a hydrogenated amorphous silicon PIN semiconductor device of hybrid glow discharge/reactive sputtering fabrication. The hybrid fabrication method is of advantage in providing an ability to control the optical band gap of the P and N layers, resulting in increased photogeneration of charge carriers and device output.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.