Cylindrical magnetron sputtering cathode and apparatus
US4407713A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 6, 1981 |
| Grant date | Oct 4, 1983 |
| Priority date | — |
| Expiry date | Aug 6, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The cylindrical magnetron sputtering cathode (10) of the present invention essentially comprises a tubular target (20) having a face (20a) of material to be sputtered, and a magnet assembly (45) disposed behind the back face of said tubular target for generating magnetic fields having flux lines which form arch portions (50,51) over the sputtering face. This magnet assembly (45) more specifically consists of a plurality of equiangularly spaced axially extending radially magnetized magnets arranged in such a manner as to form over the sputtering face (20a) a plurality of equiangularly spaced axially extending straight arch portions (50) connected to each other by arcuate arch end-portions (51), whereby defining at least one closed-loop arch (52) over said sputtering face. This magnetron sputtering cathode further comprises closure means for delimitating in combination with the back face of said tubular target a cylindrical tight chamber enclosing the magnet assembly, as well as means for axially circulating a liquid coolant within said tight chamber, whereby ensuring a proper cooling of said cathode by enabling said liquid coolant to freely flow along the longitudinal spaces (49) de…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.