Vacuum metallized dielectric substrates and method of making same
US4407871A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 8, 1981 |
| Grant date | Oct 4, 1983 |
| Priority date | — |
| Expiry date | Oct 8, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A surprisingly corrosion and abuse resistant plastic object vacuum-metallized with a corrosion prone metal, on a dielectric substrate consists of minute specular electrically-discrete "islands" of the metal topcoated with a clear resinous layer which encapsulates and insulates the islands, one from another. The metal islands are less than one thousand angstroms thick and have an average diameter of less than three thousand angstroms. This island structure is secured by stopping the growth of the metal as it is deposited between the nucleation stage and the stage of channelization or formation of an electrically conductive film. The island structure permits the dielectric resinous topcoat to penetrate in, about and under the metal islands encapsulating and securely bonding them to the substrate. A preferred application of this invention is the manufacture of exterior automobile trim components the base structure of which is a flexible elastomer such as a thermoplastic urethane and which have the appearance of electrodeposited chrome parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.