Dewar cooling chamber for semiconductor platelets
US4408464A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1982 |
| Grant date | Oct 11, 1983 |
| Priority date | — |
| Expiry date | Mar 23, 2002 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF17C2270/0518
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A Dewar cooling chamber having a mounting assembly therein capable of supporting a semiconductor platelet for translational movement in the x, y axes and tilting movement about the z axis. Cooling of the semiconductor platelet continually takes place even while the platelet is being moved in three dimensions. This cooling is accomplished by means of a flexible, conductive loop of material which interconnects a coolant source to a clamp surrounding the platelet. The clamp fixedly secures the semiconductor platelet to the mounting assembly. The cooling chamber is capable of maintaining the semiconductor platelet at liquid nitrogen temperatures and is therefore extremely useful within a semiconductor laser system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.