Method of forming articles by plating
US4409070A · kind A · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 1982 |
| Grant date | Oct 11, 1983 |
| Priority date | — |
| Expiry date | May 7, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12063
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming an article having a rough surface for being adhesively bonded to a further member includes pressing a discontinuously surfaced layer 12 of electrically conducting material (for example copper powder) onto the surface of an electrically conducting substrate 11 (for example uncured synthetic rubber loaded with carbon black), so that portions of the layer 12 are embedded in the surface. The exposed parts of the layer 12 are then electro-plated with a metal and the substrate is then removed to provide said formed article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.