Method of serialization of dice
US4409686A · kind A · utility
17Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1980 |
| Grant date | Oct 11, 1983 |
| Priority date | — |
| Expiry date | Jun 16, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The dice of a wafer are serialized using a wafer mask formed by stepping and repeating a chip pattern with a blank area in rows and columns on the wafer and forming distinctive location identifying indicia in the blank area on each chip using a pattern generator and stepping to each blank area on each chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.