Heat pump device
US4409799A · kind A · utility
11Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1981 |
| Grant date | Oct 18, 1983 |
| Priority date | — |
| Expiry date | Nov 12, 2001 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B17/12
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump device comprising a closed receptacle divided into a first chamber and a second chamber, means forming a hydrogen flow passage extending through the two chambers, said hydrogen flow passage permitting the flow of hydrogen but rejecting the flow of metal hydrides between the two chambers and being made at least partly of a porous material permeable to hydrogen and elastically deformable in response to an applied pressure, a first metal hydride filled in the first chamber and a second metal hydride filled in the second chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.