Sputtering apparatus and methods
US4410407A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1981 |
| Grant date | Oct 18, 1983 |
| Priority date | — |
| Expiry date | Dec 22, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/022
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of depositing material onto an object in an ionization chamber having a shutter therein which has an object-obscuring portion comprising the step of confining particles of matter deposited on the object-obscuring portion of the shutter to such object-obscuring portion while the object is being deposited with material. The object-obscuring portion of the shutter includes an open ended container, the open end thereof being formed in an upper portion of the shutter. During ionization a glow region is formed in the chamber separated from a source of the material by a dark space region. The upper surface of the shutter is disposed in the dark space region and the bottom of the container is separated from the source sufficiently to enable ionization. Prior to deposition of the material onto the object, the object-obscuring portion of the shutter is positioned between a source of the material and the object and contaminants on the surface of such source are removed therefrom and are collected within the container. After this cleaning process, the object-obscuring portion of the shutter is removed from between the source and the object to allow deposition of the material onto the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.