Conductive paste
US4410457A · kind A · utility
60Cited by
3References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 5, 1982 |
| Grant date | Oct 18, 1983 |
| Priority date | — |
| Expiry date | May 5, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electroconductive paste comprising PA1 (a) an electroconductive filler, PA1 (b) a reactive solvent, and PA1 (c) a hardener comprising PA2 (c-1) an epoxy resin, PA2 (c-2) a latent hardener, and PA2 (c-3) an epoxy compound-dialkylamine adduct, the percent by weight of (a), (b) and (c) being 95 to 50, 1 to 20 and 4 to 30, respectively, and the weight ratio of (c-1):(c-2):(c-3) being 100:0 to 30:0.1 to 40. The paste is useful for bonding electronic elements to metal lead frames and/or substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.