Method of manufacturing a laser source with stamped support
US4411057A · kind A · utility
30Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 1981 |
| Grant date | Oct 25, 1983 |
| Priority date | — |
| Expiry date | Oct 20, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S29/037
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention relates to laser sources using a semiconductor chip from which the radiation is collected by an optical fiber. In accordance with the invention there is provided a laser source in which the support for the semiconductor chip and the optical fiber is metallic. The support is stamped with an impression comprising a seat for the semiconductor chip and at least one groove for accommodating the optical fiber. The invention is applicable to radiation sources used in optical telecommunication systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.