Patent · US Expired

Laminated electric heat generating member for reflow soldering devices

US4412123A · kind A · utility

12Cited by
9References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 9, 1980
Grant dateOct 25, 1983
Priority date
Expiry dateMay 9, 2000

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05B3/10
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion. The exposed surface of the stainless steel portion can be provided with a ceramic coating to electrically insulate bight portion from the elements to be soldered. The legs of the U-shaped laminate are adapted to be connected to an electric power source through the copper and aluminu…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.