Defoaming electronic hardware
US4414606A · kind A · utility
9Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1981 |
| Grant date | Nov 8, 1983 |
| Priority date | — |
| Expiry date | Jun 15, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4973
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed wiring board assemblies (12) and the like encapsulated in foam (28) may be removed by use of a pair of sandwich structures (30) placed about the assembly. Each sandwich structure includes a pair of perforated sheets (36) with a sinuously extending filament (40) sandwiched between the sheets. Defoaming is effected by pulling the filament from the foam through the intermediary of a tool grasping ends (52) of the filament.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.