Lower temperature glass and hermetic seal means and method
US4417913A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1982 |
| Grant date | Nov 29, 1983 |
| Priority date | — |
| Expiry date | May 26, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An improved lead-free glass or glass plus alumina ceramic sealing material composition for making compression glass sealed electrical leads in semiconductor device packages is described wherein the improved sealing material consists essentially of the following range of ingredients, by weight percent: ______________________________________ Pb-Free Glass Element Composition Range Glass Plus Alumina ______________________________________ SiO.sub.2 40-50 34-50 Al.sub.2 O.sub.3 2-12 2-25 K.sub.2 O 2-6 2-6 Na.sub.2 O 5-9 4-9 Li.sub.2 O 2-6 2-6 CaO 0-4 0-4 ZnO 5-12 4-12 BaO 1-5 1-5 TiO.sub.2 2-6 2-6 B.sub.2 O.sub.3 13-21 11-21 ______________________________________
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.