High temperature resistant adhesive bonding composition of epoxy resin and two-part hardener
US4418166A · kind A · utility
7Cited by
13References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1981 |
| Grant date | Nov 29, 1983 |
| Priority date | — |
| Expiry date | Jul 14, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S524/906
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A solventless, cross-linked adhesive bonding composition composed of a resin base portion comprised of an epoxy resinous material containing terminal epoxy groups and being essentially free from units derived from vegetable oils and aliphatic ethers, and a filled hardener portion containing a mixture of a modified polyamine and polyamido-amine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.