Thermosetting adhesive compositions and use
US4418177A · kind A · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1982 |
| Grant date | Nov 29, 1983 |
| Priority date | — |
| Expiry date | Jan 22, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermosetting adhesive composition is disclosed which contains (a) a half-ester product of a saponified ethylene/vinyl ester copolymer with a dicarboxylic acid and (b) a solid or liquid epoxy resin, and this composition may further optionally contain a compound bearing two or more carboxyl groups, which is useful as a structural adhesive. The composition has a good storage stability and a good solubility to solvents, and can be cured at relatively low temperature in a shortened time. After curing, the composition shows good heat-resistance and has good adhesive properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.