Bondable polyamide
US4420535A · kind A · utility
14Cited by
8References
73Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1981 |
| Grant date | Dec 13, 1983 |
| Priority date | — |
| Expiry date | Oct 14, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Self-bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acid and an aliphatic dibasic acid having at least 6 carbon atoms. These self-bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g. a polyester, polyester-imide, or polyamideimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.