Thermally balanced leadless microelectronic circuit chip carrier
US4420767A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1980 |
| Grant date | Dec 13, 1983 |
| Priority date | — |
| Expiry date | Aug 22, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally balanced leadless microelectronic circuit chip carrier in which the chip is mounted directly on a heat sinking member by means of a conductive stress relieving polyimide. The heat sinking member, which has a support surface for the chip and an extending threaded shaft, is held by a carrier member thermally compatible with the surface on which the package is to be used. The shaft passes through the carrier member and receiving surface to a heat sinking nut which holds the package to the receiving surface. Leads on the carrier member surface are used to connect the receiving surface to the wires bonded to the chip contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.