Thermal compensation for magnetic head assembly
US4420782A · kind A · utility
3Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1981 |
| Grant date | Dec 13, 1983 |
| Priority date | — |
| Expiry date | Jun 30, 2001 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Ferrite read and write modules of a magnetic head assembly that are aligned and positioned within a nonferrite housing are clamped by a leaf spring between the walls of the housing. The leaf spring compensates for thermal mismatch between the ferrite modules and the housing, and compensates for stress fluctuation that occurs with temperature change. The clamping force of the leaf spring is precisely controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.