Resistive substrate for thermal printing ribbons comprising a mixture of thermosetting polyimide, thermoplastic polyimide, and conductive particulate material
US4421429A · kind A · utility
14Cited by
11References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 1981 |
| Grant date | Dec 20, 1983 |
| Priority date | — |
| Expiry date | Dec 22, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/914
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a thermal transfer medium which comprises a mixture of a thermosetting polyimide, a thermoplastic polyimide, and graphite. It has a steel support layer and an intermediate layer of silicon dioxide. An outer layer on the steel is the thermal ink. The mixture is applied as a dispersion with a precursor of the thermosetting polyimide. The ribbon may be recoated at the typing station by applying a hot melt of the ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.