Patent · US Expired

Process for the preparation of filaments of high tensile strength and modulus

US4422993A · kind A · utility

72Cited by
5References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 24, 1980
Grant dateDec 27, 1983
Priority date
Expiry dateJun 24, 2000

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/2913
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

The invention relates to the preparation of filaments with a high tensile strength and a high modulus and to the filaments thus prepared. A solution of a linear polyethylene with a weight-average molecular weight of at least 4.times.10.sup.5 is spun and the filaments, from which the solvent may have been removed in whole or in part, are drawn using a draw ratio of at least (12.times.10.sup.6 /M.sub.w)+1. The filaments are drawn at a temperature such that the modulus is at least 20 GPa. The invention allows filaments to be prepared at high drawing rates, of 0.5 sec.sup.-1 or more, with a modulus of at least 20 GPa and a tensile strength of at least 1 GPa.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.