Patent · US Expired

High-breakdown-voltage resistance element for integrated circuit with a plurality of multilayer, overlapping electrodes

US4423433A · kind A · utility

12Cited by
9References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 3, 1980
Grant dateDec 27, 1983
Priority date
Expiry dateJun 3, 2000

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/43

Abstract

A high-breakdown-voltage resistance element comprises a semiconductor body, an impurity layer disposed in a surface region of the semiconductor body to provide a resistor body, a first electrode connected to one end of the resistor body through a contact hole in a first insulating film formed on the surface of the semiconductor body, and a second electrode connected to the other end of the resistor body through another contact hole in the insulating film. A second insulating film is formed on the first and second electrodes, and a third electrode is connected to the first electrode through a contact hole in the second insulating film, so that the entire surface of the resistor body and adjacent areas are covered with the first, second and third electrodes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.