Deposition process
US4424271A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 1982 |
| Grant date | Jan 3, 1984 |
| Priority date | — |
| Expiry date | Sep 15, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A desired feature of deposition material is produced on a substrate by forming an adhesion inhibitor on the substrate in a pattern whose inner edges are adjacent the bounds of the feature being produced. A seedlayer is deposited over the adhesion inhibitor and exposed portions of the substrate, and a mask is formed over the seedlayer adjacent the edges of the adhesion inhibitor, the inner edges of the mask defining the feature being produced. A deposition material is deposited over the exposed seedlayer, and the mask is removed. Unwanted portions of the seedlayer and deposition layer are removed by mechanically lifting off. The adhesion inhibitor serves to inhibit the bonding of the seedlayer to the substrate sufficiently to enable the mechanical lift-off. The adhesion inhibitor is removed, either by lifting off with the seedlayer and deposition layer, or subsequently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.