Wafer aligners
US4425075A · kind A · utility
23Cited by
6References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 20, 1981 |
| Grant date | Jan 10, 1984 |
| Priority date | — |
| Expiry date | Apr 20, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for prealigning a silicon wafer prior to transfer to a work station. The wafer is spun on an aligning platform by means of air jets emanating from holes disposed in the surface of the platform while simultaneously being stopped by means of a vacuum source communicating with the surface of the platform. Sensor means detect when the wafer is centered within a first predetermined tolerance to turn off the air jets and vacuum to stop the wafer. Control means responsive to the sensor means then center the wafer to within a second predetermined tolerance. The wafer is then transported to the work station for processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.