Method and means for controlling sputtering apparatus

US4426264A · kind A · utility

Assignee

• Leybold-Heraeus GmbH · DE

Inventors

• Wolf-Dieter Munz · Somborn, DE
• Hans Wolf · Bayreuth, DE

Key dates

• Filing date: Dec 14, 1981
• Grant date: Jan 17, 1984
• Expiry date: Dec 14, 2001

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3408
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

The invention concerns an array of cathodes for sputtering apparatus that contains first, a target plate made out of the material to be sputtered, second, a system of magnets with poles of opposite signs positioned behind the target plate so that at least some of the lines of magnetic force emerging from the poles pass through and reenter the target plate, and third, a device that can be adjusted to alter the relative positions of the magnets and the target plate. The array is also set up so that at least some of the magnetic lines of force run from the poles through the target plate and back. The purpose of maintaining largely constant sputtering conditions as the target plate is consumed is achieved in accordance with the invention by moving the adjusting device essentially perpendicular to the largest surface of the target plate.