Moisture getter for integrated circuit packages
US4426769A · kind A · utility
70Cited by
7References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 14, 1981 |
| Grant date | Jan 24, 1984 |
| Priority date | — |
| Expiry date | Aug 14, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A moisture getter, which is a material capable of absorbing moisture, is painted within the cap of an integrated circuit package prior to sealing. The package is then heated to the high sealing temperature necessary to provide sealing without affecting the getter material. The getter material is formed from a family of materials which is capable of withstanding the high temperature of the sealing process without degradation and which can absorb a large amount of water after exposure to sealing temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.