Mold release composition
US4427803A · kind A · utility
21Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1983 |
| Grant date | Jan 24, 1984 |
| Priority date | — |
| Expiry date | May 3, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A mold release composition consisting essentially of: PA1 (A) a fluorine-containing polyether comprising 3-perfluoroalkyl-1,2-epoxypropane having the formula ##STR1## wherein R.sub.f represents a perfluoroalkyl group containing from 5 to 13 carbon atoms and PA1 (B) at least one additive selected from the group consisting of a silicone oil, silicone varnish, a wax and a highly fluorinated organic compound having a boiling point above 100.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.