Method for incorporating a desiccant in a semiconductor package
US4427992A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 1977 |
| Grant date | Jan 24, 1984 |
| Priority date | — |
| Expiry date | Nov 14, 1997 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A desiccant for semiconductor packaging which may be applied in liquid form consists essentially of approximately 60% by weight absolute ethyl alcohol, 25% by weight ethyl acetate, 5% by weight water, 5% by weight a source of boron, aluminum or phosphorus and 5% by weight of an organic silane having the structural formula: ##STR1## where R.sub.1 is a radical selected from the group consisting of H.sup.-, CH.sub.2 .dbd.CH.sup.-, CH.sub.3 O.sup.-, C.sub.2 H.sub.5 O.sup.-, CH.sub.3 CO.sub.2 .sup.-, C.sub.2 H.sub.5 CO.sup.-, and C.sub.3 H.sub.7 O.sup.-, and R is a radical selected from the group consisting of CH.sub.3 O.sup.-, C.sub.2 H.sub.5 O.sup.-, C.sub.3 H.sub.7 O.sup.-, CH.sub.3 CO.sub.2.sup.-, C.sub.2 H.sub.5 CO.sub.2.sup.-, Si.sup.+, OH.sup.-, and O.sup.-. The sources of boron, aluminum, and phosphorus may be halides, oxides or nitrates. Also a process for incorporating the foregoing into semiconductor package and process for formulating the above solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.