Additive composition, bath and process for acid copper electroplating
US4430173A · kind A · utility
49Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1982 |
| Grant date | Feb 7, 1984 |
| Priority date | — |
| Expiry date | Jul 16, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Additive composition for an acid copper electroplating bath, which bath being well adapted for the copper plating of printed circuits, is comprised of (1) the sodium salt of .omega.-sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.