Filaments of high tensile strength and modulus
US4430383A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1982 |
| Grant date | Feb 7, 1984 |
| Priority date | — |
| Expiry date | Sep 30, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2913
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to the preparation of filaments with a high tensile strength and a high modulus and to the filaments thus prepared. A solution of a linear polyethylene with a weight-average molecular weight of at least 4.times.10.sup.5 is spun and the filaments, from which the solvent may have been removed in whole or in part, are drawn using a draw ratio of at least (12.times.10.sup.6 /M.sub.w)+1. The filaments are drawn at a temperature such that the modulus is at least 20 GPa. The invention allows filaments to be prepared at high drawing rates, of 0.5 sec.sup.-1 or more, with a modulus of at least 20 GPa and a tensile strength of at least 1 GPa.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.