Laminate product of ultra thin copper film on a flexible aluminum carrier
US4431710A · kind A · utility
15Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1983 |
| Grant date | Feb 14, 1984 |
| Priority date | — |
| Expiry date | May 27, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns is made by a method which includes as the step of forming an initial copper film by vapor depositing copper directly in contact with an as-rolled aluminum carrier sheet at temperature between about 100.degree. C. and 250.degree. C. so that the carrier release peel strength has an average value between about 0.5 and 2.0 pounds per inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.