Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups

US4431792A · kind A · utility

Assignee

• The United States of America as represented by the Administrator of the National Aeronautics and Space Administration · US

Inventors

• Terry L. St. Clair · Poquoson, US
• James F. Wolfe · Redwood City, US
• Thomas D. Greenwood · Bristol, US

Key dates

• Filing date: Dec 7, 1982
• Grant date: Feb 14, 1984
• Expiry date: Dec 7, 2002

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G69/28
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The compounds are of the class of aromatic polyamides useful as matrix resins in the manufacture of composites or laminate fabrication. The process for preparing this thermoplastic-thermoset polyamide system involves incorporating a latent crosslinking moiety along the backbone of the polyamide to improve the temperature range of fabrication thereof wherein the resin softens at a relatively low temperature (.congruent.154.degree. C.) and subsequently "sets-up" or undergoes crosslinking when subjected to higher temperature (.congruent.280.degree. C.).