Temperature-controlled support for semiconductor wafer
US4432635A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 1982 |
| Grant date | Feb 21, 1984 |
| Priority date | — |
| Expiry date | Mar 31, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/682
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A support for a semiconductor wafer about to be subjected to exposure through a photomask, e.g. a rotatable chuck, comprises a stage to which the wafer is temporarily adhered by suction and whose temperature is controlled by an array of Peltier elements responsive to a thermoelectric sensor disposed close to the wafer-carrying stage surface. The Peltier elements are horizontally arrayed in a rectangular block inserted between the stage and an underlying base of the support, the block being cemented into a metal frame which has only limited contact with the stage and the base to minimize heat conduction therebetween. The base has channels for the circulation of a temperature-modifying fluid such as water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.