Process for bonding films

US4436570A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Karl-Friedrich Neuhaus · Krefeld, DE
• Horst Muller-Albrecht · Cologne, DE
• Manfred Dollhausen · Odenthal, DE
• Hermann Perrey · Krefeld, DE

Key dates

• Filing date: Jul 15, 1982
• Grant date: Mar 13, 1984
• Expiry date: Jul 15, 2002

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31551
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A film is bonded to a substrate by applying a layer of adhesive to the film to be bonded, contacting the film with a substrate and subjecting the adhesive to high energy radiation either before, during or after the film and substrate are contacted. The adhesive layer is from 0.5 to 20 .mu.m thick. The adhesive employed is a mixture of at least one polyisocyanate and at least one compound containing both a (meth)acryloyl group and a hydroxyl group in which the equivalent ratio of hydroxyl to isocyanate groups is from 0.8 to 1 to 1.3 to 1. The substrate to which the film is to be bonded may also be a film. Composites formed in accordance with the present invention are characterized by high initial bond strengths.