Method of selectively electroplating the nodes of dimpled titanium material
US4436592A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1983 |
| Grant date | Mar 13, 1984 |
| Priority date | — |
| Expiry date | Apr 25, 2003 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for selectively electroplating the nodes of dimpled titanium material. A sheet of clean dimpled titanium material is placed on a electrolyte saturated absorbent fabric covered block of conductive material. A flat sheet of metal, such as, stainless steel is placed on the opposite surface of the dimpled sheet to provide dead weight to hold only the nodes of the dimpled sheet in contact the absorbent material the dimpled sheet serving as one electrode for the electroplating process. The conductive block being the other electrode. Current is then passed through the electrolyte solution between the electrodes causing only the nodes to become plated. The electrolyte may contain, for example, copper or nickel in solution. A plating mask in the form of a frame may be placed between the flat sheet of metal and the dimpled sheet to provide uniform plating of the node surfaces. The process is repeated for the opposite side of the dimpled sheet and for successive layers of the same or different plating solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.