Plated bridge step-over connection for monolithic devices and method for making thereof
US4436766A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 15, 1981 |
| Grant date | Mar 13, 1984 |
| Priority date | — |
| Expiry date | May 15, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A step-over connection in a monolithic device including laterally spaced alizations having upper surfaces at one or more levels above a supporting substrate and a dielectric layer over one of the metalizations. The connection is in the form of a metal bridge spanning the space between the metalizations, and is formed by successive steps of providing a first resist layer, forming openings therein, etching away an area of dielectric layer, gold plating pillars on the exposed metalization surfaces, sputtering a gold film on the first resist layer and exposed pillars, providing a second resist layer with a pillar connecting bridge pattern opening, gold plating the bridge connection on the exposed sputtered gold film, and removing the resist layers and excess gold film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.