Method and apparatus for bonding metal wire to a base metal substrate
US4437943A · kind A · utility
26Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 1980 |
| Grant date | Mar 20, 1984 |
| Priority date | — |
| Expiry date | Jul 9, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process and apparatus for bonding lead wires to a metal substrate. A lead wire is positioned on the substrate and a spot of metal is deposited over a portion of the lead wire and metal substrate to firmly bond the wire to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.