Patent · US Expired

Copper plating procedure

US4437948A · kind A · utility

10Cited by

10References

11Claims

0Family size

Assignee

Bell Telephone Laboratories, Inc. · US

Inventors

Yutaka Okinaka · Madison, US
Craig G. Smith · Trexlertown, US
Lawrence E. Smith · Indianapolis, US

Key dates

Filing date	Oct 16, 1981
Grant date	Mar 20, 1984
Priority date	—
Expiry date	Oct 16, 2001

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D3/38
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A process is described for the electrodepositon of copper on various surfaces. The process involves use of a nonconsumable counterelectrode. Of particular significance is the composition of the surface of the counterelectrode. The surface of the counterelectrode comprises iridium oxide and tantalum oxide. Such processes can be carried out at high speeds, with smaller and more efficient equipment and can use various copper compounds as a source of copper.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.