Method for covering with cylindrically shaped heat-shrinkable film
US4439258A · kind A · utility
3Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 1982 |
| Grant date | Mar 27, 1984 |
| Priority date | — |
| Expiry date | May 13, 2002 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G5/147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a method for covering a substrate with a cylindrically shaped heat-shrinkable film, particularly to a method for covering a cylindrically shaped heat-shrinkable film so as to fit the contour of a substrate by conducting the heat treatment in multiple steps at different temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.