Thin film discrete decoupling capacitor
US4439813A · kind A · utility
43Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 1981 |
| Grant date | Mar 27, 1984 |
| Priority date | — |
| Expiry date | Jul 21, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A decoupling capacitor for mounting on an integrated circuit multi-layer ceramic. A bottom layer electrode, is evaporated or sputtered onto a carrier. A high dielectric layer is deposited followed by the upper metallurgy and a top isolating layer. Via holes are etched to respective electrode layers, BLM deposited thereon followed by solder balls. The electrode is mounted onto the substrate, solder balls face down in contact with a compatible footprint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.