Process and bath for the electrodeposition of tin-lead alloys
US4440608A · kind A · utility
5Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1982 |
| Grant date | Apr 3, 1984 |
| Priority date | — |
| Expiry date | Aug 16, 2002 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process is provided for the electrodeposition of alloys of tin and lead by passing electrical current through an anode, an aqueous acidic plating solution and a cathode, wherein the aqueous acidic plating bath includes at least one organic compound having a formula ##STR1## wherein X=O, S, or NH and R.sub.2 and R.sub.3 are H, or lower alkyl and R.sub.1 is ##STR2## .
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.