Heat shrinkable material
US4440821A · kind A · utility
17Cited by
3References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1980 |
| Grant date | Apr 3, 1984 |
| Priority date | — |
| Expiry date | Apr 17, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Heat shrinkable material comprising a heat shrinkable substrate and a layer of different kinds of adhesives provided on the substrate, which exhibits excellent impact resistance and adhesion properties over a wide temperature range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.