Substrate for a microwave electronic circuit and a method for the making of said substrate
US4440828A · kind A · utility
5Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1983 |
| Grant date | Apr 3, 1984 |
| Priority date | — |
| Expiry date | Apr 14, 2003 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/263
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The substrate is formed by a plate of boron nitride having a composition of 42% B, 53.5% N.sub.2, containing between 1.5 and 2.5% O.sub.2, and 1.5% Ca. The surface is increased in hardness and made non-friable by deposition of a glass film to a depth within the range of 10 to 15 microns. This deposit permits surface metallization and ensures cohesion of the boron nitride grains.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.